Training Stuff

Brief Introduction on BHB, BAM, and BAB250℃ Strain Gage

release date:2017-02-07 23:53:21


2. Specifications

1) BHB Series
Imported Glass Fiber Reinforced Epoxy as backing material, the BHB series offer excellent creep and zero return performance. With low hydroscopicity (lower than 0.5%), excellent heat-resistance (stability is lower than 45PPM) and high response speed, BHB series are suitable for Class C3 and higher accuracy load cells manufacturing.

Key Specifications:

Backing Thickness (um)    32±5    Sealing Layer Thickness(um)    20±2    

Backing Material    Glass Fiber Reinforced Epoxy    Grid Material    Konstantan Foil    

Resistance(Ω)    120,350,1000    Resistance Tolerance (%)    ≤±0.15    

Gage Factor    2.00~2.20    Dispersion of Gage Factor(%)    ≤±1    

Temp. Range(℃)    -30~+80    STC Code    9,11,16,23,27    

STC Precision(um/m/℃)    0.5    Insulation Resistance(MΩ)    10000    

Strain Limit    2.0%    Fatigue Life(±1000)    10000000    


2) BAM Series
Special polyimide film backing, the BAM series offer better creep and back to zero function. With thin backing film, good heat resistance (stability is lower than 35PPM), low hydroscopicity(lower than 0.6%), excellent performance and easy bonding, BAM series are suitable for Class C3 and higher accuracy load cells manufacturing.

Key Specifications:

Backing Thickness(um)    30±1    Sealing Layer Thickness(um)    30±1    

Backing Material    Polyimide Film    Grid Material    Konstantan Foil    

Resistance(Ω)    350,650,1000    Resistance Tolerance(%)    ≤±0.1    

Gage Factor    2.00~2.20    Dispersion of Gage Factor(%)    ≤±1    

Temp. Range(℃)    -30~+80    STC Code    9、11、16、23、27    

Strain Limit(%)    2.0    Fatigue Life    10000000    

Insulation Resistance(MΩ)    10000    


3) BAB 250℃ Series
Imported Glass Fiber Reinforced Polyimide backing, BAB series offer excellent heat resistance, good insulation, thin backing film, high stability and are suitable for both high precision stress analysis and accuracy transducers with temperature up to 250℃.

Key Specifications:

Backing Thickness(um)    32±5    Sealing Layer Thickness(um)    20±2    

Backing Material    Glass Fiber Reinforced Polyimide    Grid Material    Karma Foil    

Resistance(Ω)    120,350,1000    Resistance Tolerance(%)    ≤±0.15    

Gage Factor    1.86~1.98    Dispersion of Gage Factor(%)    ≤±1    

Temp. Range(℃)    -269~+250    STC Code    9,11,16,23,27    

STC Precision(um/m/℃)    1.0    Insulation Resistance(MΩ)    10000    

Strain Limit    1.5%    Fatigue Life(±1000)    10000000    


3. Notes:
1) For BHB and BAM series strain gages, ZEMIC offers the High Performance Epoxy: H-600, H-610. They are accordance with the function of the strain gages and can be applied as adhesive.
2) The recommended soldering temperature is 280℃, the maximum is 330℃. When soldering, it is better to control the temperature as well as the soldering time since extra heat is harm for the strain gages, especially the insulation.
3) Be careful and cautious when using BHB, BAB series strain gages, in consideration of the fragility of the backing film.
4) The special requirements of the lead wires should be specified in the strain gages designation system.